Title:
COMPOUND FOR PHOTORESIST, PHOTORESIST LIQUID, AND ETCHING METHOD USING THIS
Document Type and Number:
Japanese Patent JP2009203349
Kind Code:
A
Abstract:
To provide a novel compound for photoresist being used for performing precision-machining utilizing photo-lithography, a photoresist liquid using the compound for photoresist, and an etching method for etching a desired surface using the photoresist liquid.
The compound for photoresist has a merocyanine pigment backbone. The photoresist liquid contains the compound for photoresist. The etching method for a surface to be machined uses the photoresist liquid.
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Inventors:
WATANABE TETSUYA
USAMI YOSHIHISA
USAMI YOSHIHISA
Application Number:
JP2008047130A
Publication Date:
September 10, 2009
Filing Date:
February 28, 2008
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
C09B23/00; C07D209/18; C07D213/57; C07D215/12; C07D263/32; C07D263/56; C07D277/20; C07D277/30; C07D277/64; C07D339/06; C07D409/04; C07D417/04; C09B57/00; G03F7/004; G03F7/36; G03F7/40; H01L21/027; H01L21/3065
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Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes