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Title:
COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST
Document Type and Number:
Japanese Patent JP2002265530
Kind Code:
A
Abstract:

To obtain a resin for photoresist which is excellent in homogeneity and can give a fine pattern with a high resolution.

A compound represented by formula (1) (wherein Ra is H or methyl; and R1 is a 1-10C hydrocarbon group) is provided.


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Inventors:
TSUTSUMI KIYOHARU
ITOKAZU TERUO
Application Number:
JP2001062435A
Publication Date:
September 18, 2002
Filing Date:
March 06, 2001
Export Citation:
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Assignee:
DAICEL CHEM
International Classes:
G03F7/027; C07C69/54; C08F20/18; C08F220/18; C08F220/26; C08F222/06; C08F232/08; C08K5/00; C08L33/04; G03F7/039; H01L21/027; (IPC1-7): C08F20/18; C07C69/54; C08F220/18; C08F220/26; C08F222/06; C08F232/08; C08K5/00; C08L33/04; G03F7/027; G03F7/039; H01L21/027
Domestic Patent References:
JP2001048931A2001-02-20
JP2000026446A2000-01-25



 
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