Title:
COMPOUND, RESIN, RESIN COMPOSITION, AND CURED ARTICLE OF PHENOL NOVOLAC TYPE
Document Type and Number:
Japanese Patent JPH04220413
Kind Code:
A
Abstract:
PURPOSE:To obtain a compd. giving a cured article which has a high heat resistance and a low water absorption and is useful as the material for sealing, laminating, etc., an electronic part by selecting a specific compd. CONSTITUTION:A compd. of formula I (wherein X is H or a group of formula II; R1 to R6 are each H, 1-4C alkyl, aryl, or halogen provided that not all of them are simultaneously H; and n is 2-10) is selected.
Inventors:
MURATA KAZUYUKI
MORITA HIROMI
KIMURA ICHIRO
NAGAO SUSUMU
MOGI SHIGERU
MORITA HIROMI
KIMURA ICHIRO
NAGAO SUSUMU
MOGI SHIGERU
Application Number:
JP41194690A
Publication Date:
August 11, 1992
Filing Date:
December 20, 1990
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
C07C37/20; C07C37/74; C07C39/12; C07D301/28; C07D303/22; C08G8/00; C08G8/24; C08G59/08; (IPC1-7): C07C37/20; C07C37/74; C07C39/12; C07D301/28; C07D303/22; C08G8/24; C08G59/08