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Title:
化合物半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP5857409
Kind Code:
B2
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Inventors:
Shuichi Tomamechi
Tetsuro Ishiguro
Application Number:
JP2011021536A
Publication Date:
February 10, 2016
Filing Date:
February 03, 2011
Export Citation:
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Assignee:
富士通株式会社
International Classes:
H01L21/338; H01L21/205; H01L21/336; H01L21/76; H01L21/762; H01L27/095; H01L29/778; H01L29/78; H01L29/786; H01L29/812
Domestic Patent References:
JP5036729A
JP63108709A
JP63007672A
Attorney, Agent or Firm:
Takayoshi Kokubun



 
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