Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COMPOUND SOUND ABSORBING STRUCTURE AND STORAGE STRUCTURE USING THE SAME
Document Type and Number:
Japanese Patent JP2010079164
Kind Code:
A
Abstract:

To provide a compound sound absorbing structure improving sound absorbing performance by compounding a surface layer and a main material layer, and by combining them with nonwoven fabric in which a porous sound absorbing material is used as a base, and also to provide a storage structure using the same.

The compound sound absorbing structure 10 is constituted by combining a base structure 1 obtained by compounding the surface layer 3 in which two nonwoven fabrics A and B being cloth materials such as span bond are used and the main material 2 which is composed of a polyester fabric or is mainly composed of the polyester fabric, with the nonwoven fabric 4 on which fire proofing/water proofing treatment is applied, a mesh structure 5 of a metallic system such as a metal mesh, and a punching metal 6 as a protective cover. By controlling flow resistance on the surface layer 3, it is effective for sound absorbing performance to adjust the flow resistance of the base structure 1 to be (2.0 to 5)104 (N sec)/m4, and it is lightweight with a thickness of 40 to 50 mm, and it is also used as an all-weather type. The stable sound absorbing performance is provided from a low/middle frequency band to a high frequency band, especially around 400 Hz.


Inventors:
ITO KOICHI
TAKANO YASUSHI
MUTO DAISUKE
WATANABE MAKOTO
CHOYA TAKAHIRO
IIDA KAZUYOSHI
TAMATA SEIJI
IKEDA KOJI
WADA RYOICHI
Application Number:
JP2008249934A
Publication Date:
April 08, 2010
Filing Date:
September 29, 2008
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI LTD
BRIDGESTONE KBG CO LTD
International Classes:
G10K11/172; E01B19/00; E01F8/00
Domestic Patent References:
JP2008008997A2008-01-17
JP2000129816A2000-05-09
JPH10266386A1998-10-06
JP2002137318A2002-05-14
JP2002201731A2002-07-19
Attorney, Agent or Firm:
Patent Business Corporation Daiichi International Patent Office