Title:
複合形材及びその製造方法
Document Type and Number:
Japanese Patent JP3566777
Kind Code:
B2
Abstract:
The compound profile consists of a light-metal carrier body and at least one further profile component, in particular, a profile strip which is/are made of another material and is/are joined to the carrier body as a surface coating during an extrusion process. The profile strip (18, 18a, 18b) is provided at least on one longitudinal edge (20) with protrusions (24, 24a, 24b) which are embedded into the carrier body. Additionally/alternatively, the inner surface (21) of the profile strip is provided with additional elements which are embedded into the carrier body.
Inventors:
Diethelm Wempner
Joachim Grueck
Uwe Bock
Joachim Grueck
Uwe Bock
Application Number:
JP6956195A
Publication Date:
September 15, 2004
Filing Date:
March 28, 1995
Export Citation:
Assignee:
Alusuisse Technology & Management Ltd.
International Classes:
B21C23/22; B21C23/24; F16S3/04; (IPC1-7): F16S3/04; B21C23/22
Domestic Patent References:
| JP62013089B2 | ||||
| JP59023195A |
Attorney, Agent or Firm:
Kazuo Shamoto
Shosuke Imai
Tadashi Masui
Tadahiko Kurita
Yasushi Kobayashi
Kunihiro Sano
Shosuke Imai
Tadashi Masui
Tadahiko Kurita
Yasushi Kobayashi
Kunihiro Sano