Title:
充填材配合シリコーン組成物のコンパウンディング
Document Type and Number:
Japanese Patent JP5258953
Kind Code:
B2
Abstract:
High levels of silica, processing fluid and high molecular weight silicone polymer are compounded into a homogeneous silica filled composition without forming a preconcentrate of fumed silica and polymer. A fumed silica is fed into a unitary continuous compounding apparatus at a first location prior to addition of the silicone polymer. The fumed silica is then compounded with the silicone polymer, which is fed into the compounding apparatus at a location down-stream in the compounding apparatus from the first location. The compounding apparatus can be a co-rotating, intermeshing double screw extruder.
Inventors:
Sylvie, Novello
Gia mattie, mark howard
Gia mattie, mark howard
Application Number:
JP2011266726A
Publication Date:
August 07, 2013
Filing Date:
December 06, 2011
Export Citation:
Assignee:
Momentive Performance Materials, Inc.
International Classes:
B29B7/48; C08J3/20; B29B7/30; B29B7/90; B29C48/29; B29C48/38; B29C48/395; B29C48/40; B29C48/57; C08J3/205; B29C48/09; B29C48/12; B29K83/00; B29K105/16; B29K309/00
Domestic Patent References:
| JP2003517958A | ||||
| JP10140007A | ||||
| JP61040327A | ||||
| JP7003034A |
Attorney, Agent or Firm:
Kazuko Fujita