Title:
COMPOUND, MOLDING, AND CURED PRODUCT OF COMPOUND
Document Type and Number:
Japanese Patent JP2023054087
Kind Code:
A
Abstract:
To provide a compound which is excellent in flowability.SOLUTION: A compound has a metal filler containing first metal powder, and a resin composition, wherein the first metal powder contains a plurality of first metal particles, at least a part of the surface of the first metal particles is covered with glass containing Si, a median diameter of the first metal powder is 1.0 μm or more and 5.0 μm or less, and the compound is worked by transfer molding.SELECTED DRAWING: None
Inventors:
Soichiro Suda
Takashi Inagaki
Chihara Ishihara
Takeuchi Kazumasa
Takashi Inagaki
Chihara Ishihara
Takeuchi Kazumasa
Application Number:
JP2023020143A
Publication Date:
April 13, 2023
Filing Date:
February 13, 2023
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
C08L101/00; B29C45/02; C08K3/08; C08K3/11; C08K5/101; C08K5/3445; C08K7/18; C08K9/02; C08L63/00
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano