Title:
ブリスタ包装機におけるブリスタ成形型への圧空供給機構
Document Type and Number:
Japanese Patent JP6931149
Kind Code:
B2
Abstract:
To provide a pressured air supply mechanism to a blister forming die in a blister packaging machine where a one-touch coupler is disused so that the change of a die can be performed simply, and where pipe arrangement becomes easy.SOLUTION: An air feed pin 5 of a lower die and an air feed pin 6 of an upper die where pressured air is supplied from a pressured air source are respectively arranged to an upper fixing base 1 and a lower fixing base 2 which fix a forming upper die 3 and a forming lower die 4, and at the time of blister forming that the forming upper die 3 and the forming lower die 4 are closed, top opening portions of the air feed pin 5 of the lower die and the air feed pin 6 of the upper die contact with an opening portion 31 etc. of pressured air passages formed to the forming lower die 4 and the forming upper die 3, and connects with pressured air passages 53, 63 formed to the air feed pin 5 of the lower die and the air feed pin 6 of the upper die, so that the pressured air is supplied in the pressured air passages formed to the forming lower die 4 and the forming upper die 3.SELECTED DRAWING: Figure 2
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Inventors:
Ken Kodai
Application Number:
JP2017125302A
Publication Date:
September 01, 2021
Filing Date:
June 27, 2017
Export Citation:
Assignee:
Mutual Co., Ltd.
International Classes:
B65B47/02; B65B47/08
Domestic Patent References:
| JP2003095220A | ||||
| JP58053415A | ||||
| JP52042161U | ||||
| JP11077762A | ||||
| JP2011098532A |
Attorney, Agent or Firm:
Osamu Mori