Title:
樹脂含浸絶縁テープの圧縮
Document Type and Number:
Japanese Patent JP2008502775
Kind Code:
A
Abstract:
The present invention provides for a method of impregnating a matrix with a high thermal conductivity filled resin 32, which produces a resin impregnated matrix. The high thermal conductivity material 30 comprises 5-60% by volume of the resin 32. This is compressed by approximately 5-30%, and the distances between the high thermal conductivity materials loaded in the resin are reduced, and the resin is then cured.
Inventors:
James david black hole smith
Gary Stevens
John William Wood
Andreas Lutz
Gary Stevens
John William Wood
Andreas Lutz
Application Number:
JP2007516576A
Publication Date:
January 31, 2008
Filing Date:
June 13, 2005
Export Citation:
Assignee:
Siemens Power Generation Inc.
International Classes:
C08J5/04; H01B3/00; H01B3/12; H02K3/30; H01B17/56
Domestic Patent References:
| JP2008504378A | 2008-02-14 | |||
| JPH11234938A | 1999-08-27 | |||
| JPS63110929A | 1988-05-16 | |||
| JPH10130496A | 1998-05-19 |
Foreign References:
| US5904984A | 1999-05-18 |
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Hiroshi Sugimoto
Einzel Felix-Reinhard
Toshiomi Yamazaki
Takuya Kuno
Hiroshi Sugimoto
Einzel Felix-Reinhard