Title:
COMPUTER PROGRAM AND INFORMATION PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2022037646
Kind Code:
A
Abstract:
To provide a computer program, or the like, configured to easily evaluate bonding strength without performing destructive testing every time.SOLUTION: A computer program (26) is executed by an arithmetic circuit (21) of an information processing apparatus (20) and causes an information processing apparatus to implement a function for predicting a failure mode of separation between an adhered body and an adhesive bonded to each other. The computer program causes the arithmetic circuit to acquire boding conditions including a plurality of bonding parameters, input the acquired bonding conditions to a prediction model (27), predict a failure mode of separation between the adhered body and the adhesive bonded under the bonding conditions, and output a prediction result. The prediction model has been learned with each of the boding conditions and the failure mode determined for separation between the adhered body and the adhesive bonded under the bonding conditions, as teacher data. The failure mode is cohesive failure or interfacial failure.SELECTED DRAWING: Figure 5
Inventors:
UTSUGI MANABU
Application Number:
JP2020141882A
Publication Date:
March 09, 2022
Filing Date:
August 25, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
G01N3/08; G06F30/10; G01N3/24; G01N19/04; G06F30/20; G06F30/27; G06N20/00
Attorney, Agent or Firm:
Michiko Matsutani
Hiroshi Okabe
Hiroshi Okabe
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