Title:
CONDITIONER FOR CHEMICAL-MECHANICAL-PLANARIZATION PAD AND RELATED METHODS
Document Type and Number:
Japanese Patent JP2023153782
Kind Code:
A
Abstract:
To provide: abrasive surfaces and pad conditioners that contain high-precision shaped surfaces, including pad conditioners useful for conditioning a chemical-mechanical processing (CMP) pad; and related methods.SOLUTION: A pad conditioner useful for conditioning a chemical-mechanical processing (CMP) pad has an abrasive surface 10 including a planar land surface 24. Three-dimensional protrusions 22 extend from the planar land surface 24 and are arranged in a regular repeating pattern separated by spaces 26 and spaces 28. The protrusions 22 are conical with a circular base but other shapes are also useful.SELECTED DRAWING: Figure 1B
Inventors:
RAJESH TIWARI
CONRAD SURIAGA
BRUCE ARRINGTON
PATRICK DOERING
ANDREW ALLAN GALPIN
CONRAD SURIAGA
BRUCE ARRINGTON
PATRICK DOERING
ANDREW ALLAN GALPIN
Application Number:
JP2023112333A
Publication Date:
October 18, 2023
Filing Date:
July 07, 2023
Export Citation:
Assignee:
ENTEGRIS INC
International Classes:
B24B53/017; B24B53/12; B24D3/00; H01L21/304
Attorney, Agent or Firm:
Sonoda & Kobayashi Patent Attorneys Corporation