Title:
化学機械平坦化パッド用コンディショナおよび関連する方法
Document Type and Number:
Japanese Patent JP7374126
Kind Code:
B2
Abstract:
Described are abrasive surfaces and pad conditioners that contain high precision shaped surfaces, including pad conditioners useful for conditioning a chemical-mechanical processing (CMP) pad, and related methods.
Inventors:
Tiwari, Rajesh
Sriaga, Conrad
arlington, bruce
Doering, Patrick
Galpin, Andrew Alan
Sriaga, Conrad
arlington, bruce
Doering, Patrick
Galpin, Andrew Alan
Application Number:
JP2020564471A
Publication Date:
November 06, 2023
Filing Date:
May 15, 2019
Export Citation:
Assignee:
Entegris Incorporated
International Classes:
B24B53/12; B24B53/017; B24D3/00; B24D3/14; H01L21/304
Domestic Patent References:
| JP10138120A | ||||
| JP2007044824A | ||||
| JP9168962A | ||||
| JP2015527941A |
Attorney, Agent or Firm:
Sonoda & Kobayashi Patent Attorneys Corporation
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