Title:
CONDUCTION SHEET
Document Type and Number:
Japanese Patent JP3806390
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conduction sheet capable of well securing the reliability of connection.
SOLUTION: An area of an adhesive part 13 can be made large by securing an area of a connecting part 12B, as a conductive part 12 consisting of a line part 12A and the connecting part 12B formed wider than the line part 12 and the adhesive part 13 at a position other than that for the conductive part 12 are formed on a flexible sheet 11. As a result, both an adhesive power of the adhesive part 13 and a connection area of the connecting part can be increased to achieve both reliability of connection and reliability of adhesion.
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Inventors:
Maeda Hidefumi
Kentaro Mimura
Kentaro Mimura
Application Number:
JP2002302126A
Publication Date:
August 09, 2006
Filing Date:
October 16, 2002
Export Citation:
Assignee:
Toko Industry Co., Ltd.
Hioki Co., Ltd.
Hioki Co., Ltd.
International Classes:
H01R11/01; (IPC1-7): H01R11/01
Domestic Patent References:
| JP61151273U | ||||
| JP10241765A | ||||
| JP3104963U | ||||
| JP56009976A | ||||
| JP4067601A |
Attorney, Agent or Firm:
Koichi Washida