To provide an adhesive composition, as an adhesive composition for a protective film for use in a working process, having suitable adhesion, and excellent in punching workability, especially free from zipping, adhesive residues and powdery adhesive stains, as well as to provide a conductive protective film for use in the working process using the adhesive.

This adhesive composition comprises a specific amount of a conductive composition (B) composed of a dimethylsilicon compound containing a polyoxyalkylene group and an alkali metal ion, and a specific amount of crosslinking agent (C) having an isocyanate group, based on an acrylic copolymer (A) containing a hydroxy group-containing monomer as a copolymerizing component and having a specific glass transition temperature (Tg).

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