CONDUCTIVE ADHESIVE BOND - PREH ELEKTRO FEINMECHANIK

Title:

CONDUCTIVE ADHESIVE BOND

Document Type and Number:

Japanese Patent JP2003346930

Kind Code:

A

Abstract:

To provide conductive adhesive bonds preferably used where the contact bonds are subject to great temperature variations, for example, on a throttle valve actuator, in a state of being mechanically more stable.

A surface 2 of a contact area 1 is machined and the surface is structured with structures 4 such as ribbing, prickles, etc., to increase the mechanical stabilization of the conductive adhesive bonds. By applying this structure 4, the conductive adhesive 3 is mechanically firmly interlocked at these points. This leads to high contact reliability also at extreme temperature changes.

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Inventors:

SCHMITT HANS-MICHAEL
REUSS OSWALD
SUCKFUELL ANNEGRET
HEMMERT KLAUS

Application Number:

JP2003130597A

Publication Date:

December 05, 2003

Filing Date:

May 08, 2003

Export Citation:

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Assignee:

PREH ELEKTRO FEINMECHANIK

International Classes:

H01R4/04; H01R12/55; (IPC1-7): H01R4/04

Attorney, Agent or Firm:

Mitsufumi Ezaki (3 others)

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