Title:
導電性接着剤、それを用いた接着構造体及び電子部品
Document Type and Number:
Japanese Patent JP7413024
Kind Code:
B2
Abstract:
Provided are: an electrically conductive adhesive which exhibits excellent adhesive properties and storage stability and which is obtained using an ultraviolet radiation-curable resin; and a joined structure and electronic component obtained using the electrically conductive adhesive. This electrically conductive adhesive contains a (meth)acrylate (A), a photopolymerization initiator (B), a phosphoric acid group-containing monomer (C), a polyester resin (D) that is soluble in an organic solvent, and electrically conductive particles (E). The phosphoric acid group-containing monomer (C) is preferably a phosphoric acid group-containing (meth)acrylate. The polyester resin (D) is preferably an amorphous polyester resin.
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Inventors:
Mari Tokutake
Shinji Abe
Shinji Abe
Application Number:
JP2020000812A
Publication Date:
January 15, 2024
Filing Date:
January 07, 2020
Export Citation:
Assignee:
Nippon Chemical Industry Co., Ltd.
International Classes:
C09J9/02; C09J4/02; C09J11/04; C09J11/06; C09J167/00; H01B1/20; H01B1/22; H01B5/16
Domestic Patent References:
| JP2009147050A | ||||
| JP2012041541A | ||||
| JP2017101131A | ||||
| JP200435686A | ||||
| JP2009117738A | ||||
| JP200443601A | ||||
| JP2004043602A | ||||
| JP2004043601A |
Foreign References:
| WO2004001498A1 |
Attorney, Agent or Firm:
Patent Attorney Showa International Patent Office
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