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Title:
CONDUCTIVE ADHESIVE COMPOSITION FOR WATERPROOF CONSTRUCTION AND WATERPROOF STRUCTURE
Document Type and Number:
Japanese Patent JP2018115302
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a waterproof structure which can be easily formed at a construction site, and can inspect flaws such as pin holes with a high voltage type flaw detector, and to provide a conductive adhesive composition for waterproof construction used for formation of the waterproof structure.SOLUTION: A conductive adhesive composition for waterproof construction contains an adhesive component and a conductive filler, where a surface electric resistance as measured according to JIS K 6911 of the conductive adhesive composition is 1×10to 1×10Ω. The adhesive component is preferably at least one selected from the group consisting of an epoxy-based component, an urethane-based component, an asphalt-based component, an acrylic component, a styrene butadiene-based component, a chloroprene-based component, a nitrile-based component, a silicone-based component and a modified-silicone-based component. The conductive filler is preferably at least one selected from the group consisting of a metal oxide, metal, a conductive polymer and carbon black. The waterproof structure is formed by stacking a waterproof layer on a conductive adhesive layer formed from the conductive adhesive composition.SELECTED DRAWING: Figure 1

Inventors:
TAMARU HIROAKI
KAMEI MASAHIRO
ABE KAZUHIRO
Application Number:
JP2017008961A
Publication Date:
July 26, 2018
Filing Date:
January 20, 2017
Export Citation:
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Assignee:
TAJIMA ROOFING INC
International Classes:
C09J201/00; C09J9/02; C09J11/04; E04D5/14; E04D7/00
Domestic Patent References:
JP2018040164A2018-03-15
JPH1162122A1999-03-05
JP2003253822A2003-09-10
JP2011231297A2011-11-17
JP2016108461A2016-06-20
JP2006225648A2006-08-31
JPH08269292A1996-10-15
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Satoshi Deno
Naori Kota



 
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