Title:
CONDUCTIVE ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2016074911
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive adhesive composition suitably used for electrically joining a plurality of solar cells.SOLUTION: The conductive adhesive composition contains (A) conductive particles containing a metal having a melting point of 210°C or lower, (B) a thermosetting resin, and (C) a flux activator. The viscosity of the conductive adhesive composition is 5-30 Pa s, and the content of the conductive particles (A) is 70-90 mass% based on the total amount of the conductive adhesive composition.SELECTED DRAWING: Figure 1
Inventors:
YOKOCHI SEIGO
HAYASHI HIROKI
HAYASHI HIROKI
Application Number:
JP2015226037A
Publication Date:
May 12, 2016
Filing Date:
November 18, 2015
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J201/00; C09J9/02; C09J11/04
Domestic Patent References:
| JP2009138155A | 2009-06-25 | |||
| JP2010135807A | 2010-06-17 | |||
| JP2010000442A | 2010-01-07 | |||
| JP2006199937A | 2006-08-03 | |||
| JP2009283453A | 2009-12-03 | |||
| JP2009113033A | 2009-05-28 | |||
| JP2005079251A | 2005-03-24 | |||
| JP2006286956A | 2006-10-19 | |||
| JP2004359830A | 2004-12-24 | |||
| JP2009084510A | 2009-04-23 |
Foreign References:
| WO2009069273A1 | 2009-06-04 | |||
| US20090269598A1 | 2009-10-29 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano