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Patent Searching and Data


Title:
導電性接着剤及びその製造方法
Document Type and Number:
Japanese Patent JP3991218
Kind Code:
B2
Abstract:
A conductive adhesive composition is obtained by mixing a binder resin with 30-98 wt % based on the adhesive composition of a silver powder as a conductive agent. The silver powder contains a silver powder consisting of flat primary particles and having a massive agglomerate structure and a tap density of 0.1-1.5 g/cm3 in an amount of 30-98 wt % based on the adhesive composition. The conductive adhesive composition cures into a product having improved conductivity, adhesion, heat resistance, moisture resistance, ease of working and heat transfer.

Inventors:
Masachika Yoshino
Motoo Fukushima
Toshio Shiobara
Application Number:
JP2002369889A
Publication Date:
October 17, 2007
Filing Date:
December 20, 2002
Export Citation:
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Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C09J201/00; C09J9/02; C09J11/04; C09J163/00; C09J179/08; C09J183/04; H01B1/22; H05K3/32
Domestic Patent References:
JP9296158A
JP7169325A
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa