CONDUCTIVE ADHESIVE AND CONDUCTIVE PART AND ELECTRONIC PART MODULE USING THE SAME

Title:

CONDUCTIVE ADHESIVE AND CONDUCTIVE PART AND ELECTRONIC PART MODULE USING THE SAME

Document Type and Number:

Japanese Patent JP2006199937

Kind Code:

A

Abstract:

To provide a conductive adhesive carrying out solder joining for packaging of a modularized part or another electronic part at a low temperature and collectively improving both conductivity of circuit connection by the solder joining and joining strength with the adhesive.

(1) The conductive adhesive is obtained by mixing an epoxy adhesive having flux actions with SnBi solder powder. (2) The conductive adhesive is (1) the conductive adhesive in which the epoxy resin having the flux actions is a flux for soldering containing at least an epoxy resin, a curing agent and an organic acid and the SnBi solder powder is lead-free solder powder having 150-170°C melting point. (3) The electroconductive adhesive is (2) the conductive adhesive in which the organic acid is a dibasic acid having an alkyl group in the side chain.

Inventors:

ONO TAKAO
TAKAHASHI YOSHIYUKI
ITO SHUJI
ISOGAI YUKIHIRO

Application Number:

JP2005360106A

Publication Date:

August 03, 2006

Filing Date:

December 14, 2005

Export Citation:

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Assignee:

TAMURA KAKEN CO LTD
KYOWA HAKKO CHEMICAL CO LTD

International Classes:

C09J163/00; B23K35/22; B23K35/26; C09J9/02; C09J11/04; C09J11/06; C22C12/00; H01B1/22; H01L21/60

Attorney, Agent or Firm:

Tadashi Sano

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