Title:
CONDUCTIVE BALL MOUNTING APPARATUS
Document Type and Number:
Japanese Patent JP3728733
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive ball mounting apparatus in which a suction head is instantaneously elevated upward at almost the same time that the vacuum of the suction head is broken, thereby, a conductive ball is fitted into a suction hole, and a remaining ball is not produced.
SOLUTION: Following means are employed in the conductive ball mounting apparatus. First, the apparatus is equipped with the suction head to hold the conductive ball by sucking and an elevating mechanism to elevate the suction head, and the vacuum is broken by applying positive pressure into the suction head in a state that the held conductive ball is mounted on a mounting plate, and then, the suction head is elevated, and the held conductive ball is mounted on the mounting object. Second, the apparatus includes an elevating means independently provided to elevate the suction head further rapidly than the elevating mechanism. Third, the suction head is elevated by the elevating means at almost the same time that the vacuum inside the suction head is broken.
Inventors:
Takada Tsuyoshi
Kei Ikeda
Kei Ikeda
Application Number:
JP2002157024A
Publication Date:
December 21, 2005
Filing Date:
May 30, 2002
Export Citation:
Assignee:
Shibuya Industry Co., Ltd.
International Classes:
B23K3/06; H01L21/60; H05K3/34; (IPC1-7): H01L21/60; B23K3/06; H05K3/34
Domestic Patent References:
| JP10058250A | ||||
| JP2001068840A | ||||
| JP2000117566A |
Attorney, Agent or Firm:
Katsushi Nishina