Title:
CONDUCTIVE BALL MOUNTING APPARATUS
Document Type and Number:
Japanese Patent JP3931215
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive ball mounting apparatus which can correctly, surely remove an unnecessary conductive ball so that the position of the unnecessary ball detected by a detector is partially effected and the ball is removed without stopping the conductive ball mounting apparatus.
SOLUTION: The following means is employed in the conductive ball mounting apparatus. First, the detector for detecting the position of the unnecessary conductive ball on a holding plane is provided. Second, a partially removing means, which partially effects the position detected by the detector and removes the unnecessary conductive ball, is provided. Third, the detector and the partially removing means are positioned on a relatively moving path of a mounting head between a feeder and a mounting portion.
Inventors:
Hideko Hashino
Shinji Ishikawa
Nizuma Kazuo
Makoto Iwata
Kei Ikeda
Shinji Ishikawa
Nizuma Kazuo
Makoto Iwata
Kei Ikeda
Application Number:
JP2002156213A
Publication Date:
June 13, 2007
Filing Date:
May 29, 2002
Export Citation:
Assignee:
Shibuya Industry Co., Ltd.
Nippon Steel Materials Co., Ltd.
Nippon Steel Materials Co., Ltd.
International Classes:
H01L21/60; H05K3/34; (IPC1-7): H01L21/60; H05K3/34
Domestic Patent References:
| JP2002134540A |
Attorney, Agent or Firm:
Katsushi Nishina
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