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Title:
CONDUCTIVE BALL REMOVING DEVICE
Document Type and Number:
Japanese Patent JP3697666
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a conductive ball removing device capable of moving a removing means so as to keep a given space with respect to the ball retaining surface of even an inclined mount head to surely remove unnecessary conductive balls on the ball retaining surface.
SOLUTION: In the conductive ball removing device; firstly, the conductive ball removing device which approaches the lower surface of a mount head having a ball retaining surface 11 for attracting and retaining a plurality of conductive balls at the lower surface of the head to remove the unnecessary conductive balls on the ball retaining surface is provided; secondly, the removing means 14 is formed so as to be long toward the width direction of the ball retaining surface 11 of the mount head; thirdly, driving mechanisms 17, 18 and 19 for changing an angle of inclination in the length direction of the removing means 14 are provided; and fourthly, a detecting means 21 for obtaining a distance between the mount head lower surface and the removing means 14 is provided; and fifthly, the angle of inclination of the removing means 14 is changed based on the detected result of the detecting means 21 to keep a predetermined space between the removing means 14 and the lower surface of the mount head.


Inventors:
Hideko Hashino
Shinji Ishikawa
Yoshihisa Kajii
Kei Ikeda
Application Number:
JP2002156212A
Publication Date:
September 21, 2005
Filing Date:
May 29, 2002
Export Citation:
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Assignee:
Nippon Steel Corporation
Shibuya Industry Co., Ltd.
International Classes:
H05K3/34; H01L21/60; (IPC1-7): H01L21/60; H05K3/34
Domestic Patent References:
JP2000012593A
JP11040615A
JP2001060595A
JP11330123A
Attorney, Agent or Firm:
Katsushi Nishina