To enhance yield when providing a conductive bonding structure 1 by performing laser soldering to an embedded conductor 26 embedded in resin.
An embedded conductor 26 is embedded in resin in such a manner that a part of the surface is exposed in the air, and is conductively bonded to a capacitor 25 by soldering by laser beam by specifying the portion exposed in the air as a bonding portion 29. A thermal resistance section 27 is provided in the vicinity of the bonding portion 29 in the embedded conductor 26 to suppress transmission of heat transmitted from solder 2 to the bonding portion 29 to a separate portion of the embedded conductor 26 by reduction of heat transfer area. Accordingly, dissipation of heat received by irradiation of laser beam can be suppressed to thereby suppress variations of heat receiving amount by shortening irradiation time of laser beam. Therefore, yield can be enhanced when a conductive bonding structure 1 is provided by performing laser soldering to the embedded conductor 26.
| JP2007170805 | BRAZED STRUCTURE AND METHOD OF MANUFACTURING THE SAME |
| JPH11123543 | SOLDERING METHOD |
TAKIGUCHI TOMOYUKI
KUBOTA TAKAMITSU
MIZUTANI AKITOSHI
KONO SADAYUKI
| JP2007265962A | 2007-10-11 | |||
| JP2000275268A | 2000-10-06 | |||
| JP2002134903A | 2002-05-10 | |||
| JP2007222907A | 2007-09-06 |
Shinji Hase