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Title:
CONDUCTIVE COATING MATERIAL AND ADHEREND USING THE SAME
Document Type and Number:
Japanese Patent JP2014201595
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive coating material good in wettability to various adherends and capable of uniformly coating a particle surface with the conductive coating material by a specific manufacturing method when the adherends are particles with overcoming bad wettability to adherends of a conductivity coating material containing a conductive polymer and difficulty of uniformly coating particles with the conductive coating material.SOLUTION: There is provided a conductive coating containing (A) to (D) components. (A) component: polyethylene dioxythiophene. (B) component: polystyrene sulfonate. (C) component: water. (D) component: a solvent at least selected from a silane coupling agent having an alicyclic epoxy group and/or a silane-based coupling agent having a (meth)acryl group. It further contains a solvent at least selected from ethylene glycol, N-methylpyrrolidone and dimethyl sulfoxide.

Inventors:
HASE TOSHIYUKI
KOJIMA KAZUHIRO
Application Number:
JP2013075640A
Publication Date:
October 27, 2014
Filing Date:
April 01, 2013
Export Citation:
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Assignee:
THREE BOND CO LTD
International Classes:
C09D165/00; C09D5/02; C09D5/24; C09D7/12; C09D125/04; C09J9/02; C09J11/06; C09J201/00; H01B1/00; H01B1/20; H01B5/00; H01B5/14