Title:
CONDUCTIVE COMPOSITION, CONDUCTOR AND ITS FORMING METHOD
Document Type and Number:
Japanese Patent JP3706825
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive composition manifesting high conductivity without humidity dependency and having excellent film formability, moldability, achromatic transparency, solvent resistance, water resistance, hardness and weather resistance, and to provide a conductor and a forming method of the conductor obtained by forming a conductive film manifesting high conductivity without humidity dependency and having little dispersion of surface resistance and excellent film formability, moldability, achromatic transparency, solvent resistance, water resistance, hardness and weather resistance.
SOLUTION: This conductive composition comprises an indore derivative trimer A, a solvent B and a cross-linking agent C, and further if necessary, colloidal silica E, a basic compound F, a high molecular compound G, a surfactant H and/or inorganic salt I. The conductor formed of the conductive composition, and its forming method are provided.
Inventors:
Takashi Saito
Maeda Shinichi
Kaichi Saito
Maeda Shinichi
Kaichi Saito
Application Number:
JP2001316936A
Publication Date:
October 19, 2005
Filing Date:
October 15, 2001
Export Citation:
Assignee:
Mitsubishi Rayon Co., Ltd.
International Classes:
B05D5/12; C08J7/04; C09D5/24; C09D201/00; C09J9/02; C09J201/00; H01B1/12; H01B1/20; H01B5/14; H01B13/00; (IPC1-7): H01B1/12; B05D5/12; C08J7/04; C09D5/24; C09D201/00; C09J9/02; C09J201/00; H01B1/20; H01B5/14; H01B13/00
Domestic Patent References:
| JP2003100143A |
Foreign References:
| WO2002032903A1 |