Title:
CONDUCTIVE COMPOSITION AND ELECTRONIC APPARATUS USING THE SAME
Document Type and Number:
Japanese Patent JPH1140933
Kind Code:
A
Abstract:
To improve the solderability by compounding a metal which is easily alloyed with solder, a metal difficult to diffuse in solder, an oxide for blocking solder from entering, and a resin at a specified wt.%.
A conductive compsn. comprises a metal which is easily alloyed with solder 28-45 wt.%, a metal which hardly diffuses in solder 25-60 wt.%, and an oxide 3-7 wt.%. If the components exceed the upper or lower limit, the solder wettability of the compsn. will be deteriorated or solder will penetrate too deep into the compsn. The resin content of the compsn. is set to 7-30 wt.%. If it is less, the adhesion to the solder will lower, and if it exceeds, the conductivity will decrease.
Inventors:
NIKAIDO TAKASHI
ONO TAIICHI
SUZUKI KATSUYUKI
ONO TAIICHI
SUZUKI KATSUYUKI
Application Number:
JP19271897A
Publication Date:
February 12, 1999
Filing Date:
July 17, 1997
Export Citation:
Assignee:
ALPS ELECTRIC CO LTD
International Classes:
B23K35/02; B23K35/26; H01B1/16; H01B1/22; H05K3/34; H05K3/24; (IPC1-7): H05K3/34; H01B1/16; H05K3/24
Attorney, Agent or Firm:
Masatake Shiga (12 outside)