To provide a conductive paste which has excellent conductivity and sufficient adhesive strength to a board.

In this conductive paste containing a copper powder, a glass powder, and an organic vehicle, the copper powder includes (1) a copper powder A of 50 to 60 wt.%, which contains oxygen of 1-3 wt.% and its average particle size is 0.9-1.5 μm, and (2) a copper powder B of 10 to 50 wt.%, which contains oxygen of 0.2 to 3 wt.% and its average particle size is less than 0.6 μm.