Title:
CONDUCTIVE COMPOSITION, STRUCTURE AND JUNCTION DEVICE
Document Type and Number:
Japanese Patent JP2014141636
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive composition having extremely small variation of a resistance even when coated on a transparent electrode substrate and exposed to a high temperature high moisture condition, and to provide a structure using the composition and a junction device.SOLUTION: There is provided a structure obtained by coating a transparent electrode substrate with a liquid conductive composition containing (A) a saturated hydrocarbon polymer having a hydroxyl group or a hydrolyzable group bound to a silicon atom and at least one crosslinkable silicon group capable of being crosslinked by forming a siloxane bond and (B) a conductive filler.
Inventors:
KAWATE CHIEKO
OKABE YUSUKE
SAITO ATSUSHI
OKABE YUSUKE
SAITO ATSUSHI
Application Number:
JP2013220477A
Publication Date:
August 07, 2014
Filing Date:
October 23, 2013
Export Citation:
Assignee:
CEMEDINE CO LTD
International Classes:
C09J201/02; B32B7/02; C08F8/42; C08K3/00; C08L101/02; C09J11/04
Domestic Patent References:
| JP2006163110A | 2006-06-22 | |||
| JP2012156230A | 2012-08-16 | |||
| JP2011148965A | 2011-08-04 | |||
| JP2012041393A | 2012-03-01 | |||
| JP2002201455A | 2002-07-19 | |||
| JP2005340289A | 2005-12-08 |
Foreign References:
| WO2012086588A1 | 2012-06-28 | |||
| US20030078322A1 | 2003-04-24 | |||
| WO2012053520A1 | 2012-04-26 | |||
| WO2011115105A1 | 2011-09-22 |
Attorney, Agent or Firm:
Shinsuke Ishihara
Shoji Ishihara
Shoji Ishihara