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Title:
CONDUCTIVE FILM COMPOSITION
Document Type and Number:
Japanese Patent JP08302248
Kind Code:
A
Abstract:

To obtain a conductive film compsn. which uses ethylene glycol, or the like, as the main solvents, contains an indium compd., a polycarboxylic acid, or the like, and is excellent in light transmittance, abrasion resistance, and adhesion to substrates such as glass and ceramics.

This compsn. contains (A)(i) 10-40 wt.% ethylene glycol and (ii) 10-40 wt.% terpineol as the main solvents, (B) ethyl alcohol, n-butyl alcohol, and Ethyl Cellosolve as the auxiliary solvents, each in an amt. of 10-50 wt.%, and (C) solid components comprising (i) 1-10 wt.% indium compd., (ii) 0.1-3 wt.% polycarboxylic acid such as oxalic or malonic acid, and (iii) 0.1-3 wt.% tin compds. mainly comprising tin octanoate.


Inventors:
Rin, Hitsudan
Application Number:
JP1996000068856
Publication Date:
November 19, 1996
Filing Date:
March 26, 1996
Export Citation:
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Assignee:
SAMSUNG DISPLAY DEVICES CO LTD
International Classes:
B05D5/12; C09D5/24; C09D7/12; C09D167/00; C09D167/02; H01B1/20; H01J29/86; H05F1/02; B05D5/12; C09D5/24; C09D7/12; C09D167/00; C09D167/02; H01B1/20; H01J29/86; H05F1/00; (IPC1-7): C09D5/24; B05D5/12; C09D167/02