Title:
CONDUCTIVE FILM FORMING SUBSTRATE, CONDUCTIVE FILM, AND MANUFACTURING METHOD OF CONDUCTIVE FILM
Document Type and Number:
Japanese Patent JP2009190267
Kind Code:
A
Abstract:
To suppress uneven application of an ink accepting layer, also to reduce haze and to prevent bleeding in performing photogravure or the like.
A conductive film forming substrate includes a supporting body and an ink accepting layer formed on the supporting body. The ink accepting layer contains inorganic particles and resin, and a refractive index difference between the inorganic particles and the resin is within 0.05 and the grain size of the inorganic particles 0.12-0.50 m. The inorganic particles are desirably silica and the resin can use ethyl cellulose or acrylic. The thickness of the ink accepting layer is 10-50 m.
Inventors:
NISHIMURA NAOYA
Application Number:
JP2008033349A
Publication Date:
August 27, 2009
Filing Date:
February 14, 2008
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
B32B27/18; B32B15/08; C23C18/18; C23C18/31; H01B5/14; H01B13/00; H05K3/00; H05K9/00
Domestic Patent References:
| JP2006302997A | 2006-11-02 | |||
| JP2002185184A | 2002-06-28 | |||
| JP2004009362A | 2004-01-15 | |||
| JP2006294533A | 2006-10-26 | |||
| JP2006294532A | 2006-10-26 |
Attorney, Agent or Firm:
Takehiro Chiba
Toshiyuki Miyadera
Naoki Kashima
Yasuo Takubo
Shuji Ouchi
Toshiyuki Miyadera
Naoki Kashima
Yasuo Takubo
Shuji Ouchi
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