Title:
CONDUCTIVE FINE PARTICLE AND USE THEREOF
Document Type and Number:
Japanese Patent JP2015130360
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive fine particle in which migration of copper when using peroxide as a curing agent can be suppressed, and a use thereof.SOLUTION: The conductive fine particle has a conductive layer which has at least copper layer and which is formed on a surface of a resin fine particle. The conductive layer is obtained by: adding conductive fine particle of 1 mass% to mixed liquid with a 1:1 mass ratio of toluene containing 5 mass% of t-butyl peroxy-2-ethylhexanoate to ethyl acetate; conducting an elution operation of copper under a condition of 80°C for 24 hours; and then extracting an ion into pure water. The conductive layer is formed in such state that an eluted amount of copper is 100 ppm or less to the conductive fine particle in copper elution test measuring elution of copper using an inductively coupled plasma (ICP) emission spectrometry device. The conductive layer especially has a first nickel layer at an inner peripheral side of the copper layer and a second nickel layer at an outer peripheral side of the copper layer and both nickel layers contain phosphorus and the phosphorus percentage content (%) of the first nickel layer is set to be over 2%.
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Inventors:
HASEGAWA YASUHIRO
Application Number:
JP2015058878A
Publication Date:
July 16, 2015
Filing Date:
March 23, 2015
Export Citation:
Assignee:
NATOKO KK
International Classes:
H01B5/00; C09J9/02; C09J11/08; C09J201/00; H01B1/00; H01B1/22; H01B5/16; H01L21/60; H01R11/01
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda