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Title:
CONDUCTIVE FINE PARTICLE
Document Type and Number:
Japanese Patent JP2009032397
Kind Code:
A
Abstract:

To provide conductive fine particles preventing a conduction failure and reducing a resistance value.

The conductive fine particle consists of a base material fine particle, a nickel layer formed on a surface of the base material fine particle, and a low-resistance metal layer made of silver or copper containing a protrusion formed on a surface of the nickel layer. The protrusion is a conductive fine particle having a core material of a metal nano particle of the same metal with the low-resistance metal layer sandwiched between the nickel layer and the low-resistance metal layer.


Inventors:
ISHIDA HIROYA
Application Number:
JP2007191830A
Publication Date:
February 12, 2009
Filing Date:
July 24, 2007
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01B5/00; B22F1/02; C23C18/31; H01R11/01
Attorney, Agent or Firm:
Yasuo Yasutomi
Katsutoshi Moroda