Title:
導電性ホットメルト接着剤組成物、および積層体
Document Type and Number:
Japanese Patent JP7473763
Kind Code:
B2
Abstract:
To provide a conductive hot-melt adhesive composition which can strongly bond adherends in a state of exhibiting high conductivity.SOLUTION: A conductive hot-melt adhesive composition contains a thermoplastic resin and a conductive filler, and has a volume resistivity of less than 1×10Ωcm and an elastic modulus of less than 5 MPa, in which the conductive filler is at least one selected from the group consisting of graphite, carbon black, carbon nanotube, graphene, graphene oxide, silver, copper, tin, zinc, zinc oxide, nickel, manganese and ITO.SELECTED DRAWING: Figure 1
Inventors:
Yoshihisa Fukuchi
Application Number:
JP2022163490A
Publication Date:
April 24, 2024
Filing Date:
October 11, 2022
Export Citation:
Assignee:
artience Co., Ltd.
International Classes:
C09J153/02; B32B7/025; B32B7/12; C09J9/02; C09J11/06
Foreign References:
| CN103540280A | ||||
| CN107722889A | ||||
| CN109096973A |