PURPOSE: To prevent a wafer from being broken during a process wherein a semiconductor wafer is manufactured and chips are cut, to easily convey the wafer and to execute the inspection of electric characteristics while the wafer has been housed in a container.

CONSTITUTION: A wafer 102 is placed on a wafer holding part 101; claws 105 for fixation use are pushed by means of protrusion parts 104 at the inner circumference by turning a fixation part 103; the wafer 102 is fixed. Conductive buffer materials 106 are arranged in a plurality of parts on the wafer holding part 101. A cutout 107 for wafer-direction recognition use and a groove 108 for mechanical fixation use are made at the outer circumference of the wafer holding part 101. The protrusion parts 104 are made movable by means of springs 109. The claws 105 for fixation use are pressed by the protrusion parts 104; they are slid toward the central did; the side face of the wafer is held by a conductive buffer part 110. Thereby, the wafer can be conveyed by using conventional wafer carrier boxes.