導電材料、接続構造体及び接続構造体の製造方法

Title:

導電材料、接続構造体及び接続構造体の製造方法

Document Type and Number:

Japanese Patent JP7425824

Kind Code:

B2

Abstract:

The present invention provides a conductive material in which, even when the conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, yellowing of the conductive material can be sufficiently suppressed during heating. The conductive material according to the present invention contains a plurality of conductive particles having solder at an outer surface portion of a conductive portion, a curable compound, and a boron trifluoride complex.

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Inventors:

Song Shiki
Masahiro Ito
Shujiro Sadanaga

Application Number:

JP2022083053A

Publication Date:

January 31, 2024

Filing Date:

May 20, 2022

Export Citation:

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Assignee:

Sekisui Chemical Co.,Ltd.

International Classes:

H01B1/22

Domestic Patent References:

JP2016164873A

Foreign References:

WO2014112540A1

Attorney, Agent or Firm:

Patent Attorney Osaka Front Patent Office

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