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Patent Searching and Data


Title:
CONDUCTIVE MATERIAL PRECURSOR AND CONDUCTIVE MATERIAL
Document Type and Number:
Japanese Patent JP2013211104
Kind Code:
A
Abstract:

To provide: a conductive material precursor allowing manufacture of a conductive material having high conductivity even in an ultrafine line pattern; and a conductive material excellent in conductivity.

Provided is a conductive material precursor having, on a transparent support, at least a physical development nucleus layer and a silver halide emulsion layer in this order. On the silver halide emulsion layer, an upper layer is disposed which contains a polymer having a functional group represented by the general formula I or the general formula III. Also provided is a conductive material manufactured using the conductive material precursor.


Inventors:
SUNAKAWA TOMOHIDE
Application Number:
JP2012078713A
Publication Date:
October 10, 2013
Filing Date:
March 30, 2012
Export Citation:
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Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
H01B5/14; B32B7/02; C08F212/14; C08F220/56; G03C1/00; G03C1/04; H01B13/00; H05K1/09