Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONDUCTIVE MATERIAL
Document Type and Number:
Japanese Patent JP01128307
Kind Code:
A
Abstract:

PURPOSE: To simply obtain a thick molding by one process by forming a conductive material of bulky carbon fibers having bulk density under specific value to be selected from among paper, a mat, felt, chopped fibers and of polyamide resin.

CONSTITUTION: Bulky carbon fibers in the shape of paper, a mat, felt, chopped fibers having bulk density under 0.5g/cm3 are combined with polyamide resin in order to form a thick conductive material having the relatively small contents of carbon fibers. A rate of carbon fibers to this resin is, for instance, under 50wt.%. Various kinds of polyamide resin can be used, however, those capable of easily impregnating a relatively bulky material and having a low boiling point and a low melting point are suitable. In this way, by using bulky carbon fibers having bulk density under 0.5g/cm3, a thick molding can be simply obtained by one process.


Inventors:
Ito, Tetsuo
Yumitate, Yasuhiko
Furukawa, Masaru
Application Number:
JP1987000284179
Publication Date:
May 22, 1989
Filing Date:
November 12, 1987
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAINIPPON INK & CHEM INC
International Classes:
H01B1/24; H01B5/16; H01B1/24; H01B5/16; (IPC1-7): H01B1/24; H01B5/16



 
Previous Patent: CONDUCTIVE MATERIAL

Next Patent: DEFOAMING AGENT COMPOSITION