Title:
導電材料及び導電性ペースト及び基板
Document Type and Number:
Japanese Patent JP4254757
Kind Code:
B2
Inventors:
Seiki Sakuyama
Hiroki Uchida
Hiroki Uchida
Application Number:
JP2005211992A
Publication Date:
April 15, 2009
Filing Date:
July 22, 2005
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01B5/00; H01B1/22; H01B5/14; H05K3/12
Domestic Patent References:
| JP8227613A | ||||
| JP4356375A | ||||
| JP9122967A |
Attorney, Agent or Firm:
Junichi Yokoyama