PURPOSE: To make it possible to cope with actual packaging of an electronic part having a great number of terminals, and thereby obtain a conductive pad excellent in general purpose properties by arranging a plurality of conductive elements to the direction of the thickness of a board in a state that they are insulated from one another, and thereby concurrently exposing the end sections of lead wires over the front and rear surfaces of the board.
CONSTITUTION: When insulating covered wires 1 are closely arranged in parallel while being heated up to a specified temperature, the insulating covered wires 1 are fixed by a fusing body 2 so that a complex 3 in a pillar shape is thereby formed. Said complex 3 as mentioned above is cut off to the thickness as required in the direction perpendicularly intersected with the wires 1, and furthermore, cut surfaces are horizontally ground so that a board 4 is thereby obtained. Following which, insulating resin 5 is applied onto both of the front and back faces of the board 4 other than sections corresponding to the terminals of an electronic part by means of a screen printing method. A copper plate (a gold plate, a tin-lead plate and the like may be used) is applied onto sections which are not covered by the insulating layer 5, while conductive terminal sections 6 are formed so that a conductive pad 10 is thereby obtained. Said conductive pad is normally used when electronic parts are actually packaged onto a printed wiring board.
YAMAZAKI MINORU
YAMAGUCHI SHIGEO
OTSUKA HIDEO
