To provide a conductive particle hardly generating a large crack in a conductive layer even when imparting large force to the conductive particle, and to provide an anisotropic conductive material and a connection structure using the conductive particle.

A conductive particle 1 includes a base material particle 2 and a copper-tin layer 3 provided on the surface 2a of the base material particle 2. The copper-tin layer 3 contains an alloy of copper and tin. The content of copper in the whole copper-tin layer 3 exceeds 20 wt.%, and 75 wt.% or less, and the content of tin is 25 wt.% or more, and less than 80 wt.%. The base material particle 2 is a resin particle, an inorganic particle, or an organic-inorganic hybrid particle. The anisotropic conductive material contains the conductive particle 1 and a binder resin. The connection structure comprises a first connection target member, a second connection target member, and a connection part for connecting the first connection target member and the second connection target member. The connection part is formed using the conductive particle 1, or the anisotropic conductive material containing the conductive particle 1.