Title:
導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
Document Type and Number:
Japanese Patent JP5430093
Kind Code:
B2
Abstract:
The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.
Inventors:
Tomoyuki Ishimatsu
Hiroki Ozeki
Hiroshi Hamachi
Hiroki Ozeki
Hiroshi Hamachi
Application Number:
JP2008191098A
Publication Date:
February 26, 2014
Filing Date:
July 24, 2008
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
H01B5/00; H01B1/00; H01B1/22; H01B5/16; H01R11/01; H05K1/14; H05K3/32
Domestic Patent References:
| JP2004014409A | ||||
| JP2007324138A | ||||
| JP2000243132A | ||||
| JP2005166438A | ||||
| JP6052715A |
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda
Hiroshi Ikeda
Yoshihiro Nagare
Naoko Matsuda
Hiroshi Ikeda