Title:
CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2022022293
Kind Code:
A
Abstract:
To provide a conductive particle capable of conductive connection at relatively low temperatures and of enhancing conduction reliability even when the conductive connection is performed at relatively low temperatures.SOLUTION: This conductive particle according to the present invention includes a conductive particle body having a conductive part, and an insulating particle disposed on the surface of the conductive particle body. The conductive particle body has a plurality of projections on an outer surface of the conductive part, and the glass transition temperature of the insulating particle is below 100°C. The insulating particle is deformable such that: when the insulating particle is compressed under at least one compression condition satisfying the compression conditions of the temperature of 100 to 160°C and the pressure of 60 to 80 MPa, the proportion of the greatest particle diameter of the insulating particle after compression in the compression direction to the greatest particle diameter of the insulating particle after compression in a direction intersecting the compression direction is 0.7 or less.SELECTED DRAWING: Figure 1
Inventors:
YAMAGIWA HITOSHI
MAHARA SHIGEO
MAHARA SHIGEO
Application Number:
JP2021192833A
Publication Date:
February 03, 2022
Filing Date:
November 29, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01B5/00; H01B1/00; H01B1/22; H01B5/16; H01R11/01; H01R43/02
Domestic Patent References:
| JP2005044773A | 2005-02-17 | |||
| JP2015187984A | 2015-10-29 | |||
| JP2014017213A | 2014-01-30 |
Attorney, Agent or Firm:
特許業務法人 宮▲崎▼・目次特許事務所