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Title:
CONDUCTIVE PARTICULATE AND SUBSTRATE CONSTITUENT
Document Type and Number:
Japanese Patent JP2012178349
Kind Code:
A
Abstract:

To provide a conductive particulate having capacity capable of easing force applied to a circuit of a substrate or the like and to provide a method for maintaining a distance between substrates at a fixed value.

In a conductive particulate configured by covering the surface of a base material particulate composed of resin with one or more metal layers, respective thermal expansion coefficients of all the metal layers are 1×10-5 to 3×10-5 (1/K) and a ratio (thermal expansion coefficient of base material particulate/thermal expansion coefficient of metal layer) of the thermal expansion coefficient of the base material particulate to that of each metal layer is 0.1 to 10.


Inventors:
KURODA HIROSHI
OKINAGA NOBUYUKI
Application Number:
JP2012070247A
Publication Date:
September 13, 2012
Filing Date:
March 26, 2012
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01B5/00; B22F1/02; B23K35/14; B23K35/26; C22C11/06; C22C13/00; C23C28/02; C25D5/10; C25D5/56; C25D7/00; C25D15/02; H01R4/00; H01R4/04; H05K3/12; H05K3/34; H01R4/02; H01R13/03; H05K3/32
Domestic Patent References:
JPS6391903A1988-04-22
JPH0720485A1995-01-24
JPH09198916A1997-07-31
JP2000188308A2000-07-04
JPH06503180A1994-04-07
JP2000086822A2000-03-28
JP2000109709A2000-04-18
Other References:
JPN6013043702; 日本金属学会編: 金属データブック , 19740720, 12-13頁, 丸善株式会社
JPN7013003265; 液晶ディスプレイ周辺材料の市場 第1刷, 19900731, 102-109頁, 株式会社シーエムシー
JPN6013043703; JISハンドブック26プラスチックI(試験) 第1版第1刷発行, 20010131, 445-456頁
JPN7013003266; 日本レオロジー学会 編: 講座・レオロジー 第1版第5刷, 20011105, 78-83頁, 高分子刊行会
JPN7013003267; SEBS系粘着剤(ヤスハラケミカル(株)様 提供)の測定結果(1994) , 20130828
Attorney, Agent or Firm:
Atomi International Patent Office