To improve bonding between semiconductor chips or electrode substrates and elasticity thereof and prevent contact failures due to a thermal cycle by using a conductive particulate in which a nickel plating layer is applied to the bonding face.
A ceramic plate 2 and a glass fiber reinforce epoxy plate 3 having Cu electrodes 3, respectively, are conducted and bonded using a conductive particulate 4 and constitutes a substrate. An LSI chip 1 is connected to the ceramic plate 2. A cream solder 5 is applied to the respective Cu electrodes 3, and the conductive particulate 4 are adhered therebetween. A bonding part between the LSI semiconductor chip 1 and the ceramic substrate 2 may be conducted and bonded using the conductive particulate 4. A nickel plating layer of 0.5 to 100μm in thickness may be applied to the surface of the conductive particulate 4. Further, a solder plating layer may be applied to that plating layer. In this case, there is no need for using the cream solder 5.
KODERA YOSHIAKI
UKAI KAZUO
