To provide a conductive paste capable of forming an anisotropic conductive film in which it is easily confirmed whether it is surely conducted and connected between opposing electrodes with the anisotropic conductive film pinched, to provide the anisotropic conductive film, and to provide a manufacturing method of electronic equipment using these.

The conductive paste is made to contain an irregular-shaped conductive powder of 1.5 or more of an aspect ratio L/D and spherical powders of which the diameter d is DdL in a binder having adhesiveness. The anisotropic conductive film is prepared by molding the conductive paste into a film state. The manufacturing method of the electronic equipment is to interpose the anisotropic conductive film between the electrode of a transparent wiring board and the electrode of an electronic circuit parts, to pinch the anisotropic conductive film by the wiring board and the electronic circuit parts, and to compress it in the thickness direction while observing a compressed state of the spherical powders from a transparent wiring board side.