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Title:
CONDUCTIVE PASTE AND CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2013131459
Kind Code:
A
Abstract:

To provide a conductive paste capable of improving compactness and suppressing generation of blister, and a ceramic electronic component manufactured using the conductive paste.

In a conductive paste including metal powder as a conductive component, the metal powder contains scale-like metal powder, and the scale-like metal powder contains metal powder having a crystallite diameter of 200-400 nm. The conductive paste contains metal powder having a large crystallite diameter of 200 nm or more, so that the conductive paste is high in chemical stability and hardly sintered. Accordingly, voids in the paste easily come out, and generation of blister can be suppressed.


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Inventors:
NAOKAWA SATORU
KAWABATA TOMOYA
OKUMURA SHUN
IEMURA TSUTOMU
Application Number:
JP2011281720A
Publication Date:
July 04, 2013
Filing Date:
December 22, 2011
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
H01B1/22; H01B1/00; H01G4/30; H01G4/232
Domestic Patent References:
JP2002110444A2002-04-12
JP2004124257A2004-04-22
JP2003323815A2003-11-14
JP2005222831A2005-08-18



 
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