Title:
CONDUCTIVE PASTE FOR CERAMIC MULTILAYERED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3150932
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable a conductor circuit with less warpages to be formed even though a ceramic green sheet is baked simultaneously by having conductive powder which contains a specified amount or more of Ag powder of specific mean and maximum particle diameter produced by atomization method as a main ingredient.
SOLUTION: A conductive paste has conductive powder, containing Ag powder of 50 weight% or more, produced by atomization method the mean particle diameter of the powder is 3 to 10 μm, and maximum particle diameter is 40 μm or less as the main ingredient. Here when the mean particle diameter is less than 3 μm, it is difficult to eliminate warpage, and when the mean particle diameter is larger than 10 μm and the maximum particle diameter is larger than 40 μm, the powder is crushed into foil in making paste, which clogs screens in printing. As a result, the coefficient of contraction of the Ag powder can be made adapted to that of a ceramic green sheet by using the Ag powder in this range. This enables a warpage-free ceramic multilayered circuit board to be formed.
Inventors:
Masatoshi Suehiro
Yutaka Nakayama
Shinichi Ogura
Yutaka Nakayama
Shinichi Ogura
Application Number:
JP33137397A
Publication Date:
March 26, 2001
Filing Date:
December 02, 1997
Export Citation:
Assignee:
Daiichi Kogyo Pharmaceutical Co., Ltd.
DOWA MINING CO.,LTD.
DOWA MINING CO.,LTD.
International Classes:
H05K1/09; H01B1/16; (IPC1-7): H05K1/09
Domestic Patent References:
| JP6349315A | ||||
| JP5770243A | ||||
| JP5114328A |
Attorney, Agent or Firm:
Yoshihiro Tsunoda (3 others)