Title:
CONDUCTIVE PASTE AND CHIP-TYPE ELECTRONIC COMPONENT USING THE SAME
Document Type and Number:
Japanese Patent JP2003263922
Kind Code:
A
Abstract:
To provide a conductive paste which is improved in adhesive strength of a coating film, formed after the paste is applied and dried and can make an external electrode small and uniform in thickness, and a chip-type electronic component using the paste.
The paste includes a metal powder, a organic resin made of methyl methacrylate polymer and an alcohol containing an aromatic hydrocarbon. The aromatic alcohol is a benzyl alcohol, and an average molecular weight of the methyl methacrylate polymer is in the range of 10,000 to 700,000.
Inventors:
HARADA KAZUHIKO
Application Number:
JP2002062724A
Publication Date:
September 19, 2003
Filing Date:
March 07, 2002
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01G4/12; H01B1/22; H01G4/30; (IPC1-7): H01B1/22; H01G4/12; H01G4/30